US Department of Defense Delivers First SHIP Prototype Devices to BAE Systems

The US Department of Defense (DoD) marked a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program by delivering the first SHIP prototype devices. BAE Systems, Inc., the lead demonstrator, received the first two prototypes, which were Intel’s Multi-Chip Package for SHIP Digital and Qorvo’s Multi-Chip Module for SHIP Radio Frequency. The SHIP Program aims to provide the DoD with access to SOTA microelectronics packaging capabilities by leveraging commercial industry production flow. The program has partnered with Intel and Qorvo to develop prototype devices for DoD systems that will demonstrate enhanced capabilities with size, weight, and power savings. Additional prototype devices are under development.

https://www.defense.gov/News/Releases/Release/Article/3355049/department-of-defense-celebrates-advancements-in-microelectronics-packaging-cap/