President Trump ordered HieFo Corporation to divest its interests in certain assets of EMCORE Corporation’s digital chips business. The order, published on Jan. 2, 2026, directs HieFo— a Delaware corporation and foreign person—to relinquish all rights to EMCORE’s digital chips, wafer design, fabrication, and processing operations, including the semiconductor manufacturing facility. The Committee on Foreign Investment in the United States (CFIUS) reviewed the transaction under Section 721 of the Defense Production Act. CFIUS identified a national‑security risk related to access to EMCORE’s intellectual property and the potential diversion of indium phosphide chips away from the United States. The order came after HieFo filed the transaction only after CFIUS’s non‑notified investigation. Parties are urged to assess whether transactions fall under CFIUS jurisdiction.
https://home.treasury.gov/news/press-releases/sb0349
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